Numéro |
J. Phys. IV France
Volume 12, Numéro 3, May 2002
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Page(s) | 61 - 64 | |
DOI | https://doi.org/10.1051/jp420020037 |
J. Phys. IV France 12 (2002) Pr3-61
DOI: 10.1051/jp420020037
Parasitic conduction in a 0.13
m CMOS technology at low temperature
A. Mercha, J.M. Rafi, E. Simoen, E. Augendre and C. Claeys IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Abstract
Low temperature measurements at 4.2 K and 77 K are performed on n- and p-MOSFETs of a 0.13
m CMOS technology. Two parasitic current contributions are identified in the subthreshold regime and strong inversion at 4.2 K.
The first one is related to a parasitic parallel conduction inherent to Shallow Trench Isolation. Whereas the second one,
resulting in a second peak in the linear transconductance, is discussed in terms of a stronger impact of substrate majority
carriers due to a higher substrate resistivity at 4.2 K. The measured substrate current in n-MOSFETs is probably originating
from electrons tunneling from the substrate valence band to the gate. At 4.2 K, the substrate current induces a reduction
of the threshold voltage resulting in the measured "kink" of the
characteristic and the second transconductance peak at low drain bias.
© EDP Sciences 2002