| Numéro |
J. Phys. IV France
Volume 04, Numéro C7, Juillet 1994
8th International Topical Meeting on Photoacoustic and Photothermal Phenomena8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique |
|
|---|---|---|
| Page(s) | C7-199 - C7-202 | |
| DOI | https://doi.org/10.1051/jp4:1994748 | |
8th International Topical Meeting on Photoacoustic and Photothermal Phenomena
8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique
J. Phys. IV France 04 (1994) C7-199-C7-202
DOI: 10.1051/jp4:1994748
1 Department of Physics, Zhejiang Normal University, Jinhua 321004, China
2 Institute of Acoustics and Lab. of Modern Acoustics, Nanjing University, Nanjing 210093, China
© EDP Sciences 1994
8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique
J. Phys. IV France 04 (1994) C7-199-C7-202
DOI: 10.1051/jp4:1994748
Photoacoustic laminated characterization of dynamic integrated circuits
J.-W. Fang1, S.-Y . Zhang2 and J.-C. Cheng21 Department of Physics, Zhejiang Normal University, Jinhua 321004, China
2 Institute of Acoustics and Lab. of Modern Acoustics, Nanjing University, Nanjing 210093, China
Abstract
The layered photoacoustic imaging of dynamic integrated circuits(IC) devices is studied experimentally and theoretically. The experimental method can be used not only to investigate the surface and subsurface structures, but also to analyze the operation modes of the electronic components and the operation principles of IC devices.
© EDP Sciences 1994