J. Phys. IV France 129 (2005) 265-269
Thermal wave assessment of quality of metal - ceramics bondingZ. Suszynski and P. Majchrzak
Chair of Computer Engineering, Faculty of Electronics, Technical University of Koszalin, Sniadeckich Street, 75-453 Koszalin, Poland
In this paper, the quality of bonding between Cu and Al2O3 ceramics as well as Cu and AlN ceramics were measured and compared. The method of adhesion quality assessment presented is based on the analysis of amplitude and phase characteristics of the photoacoustic signal.
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