| Issue |
J. Phys. IV France
Volume 129, October 2005
|
|
|---|---|---|
| Page(s) | 265 - 269 | |
| DOI | https://doi.org/10.1051/jp4:2005129054 | |
J. Phys. IV France 129 (2005) 265-269
DOI: 10.1051/jp4:2005129054
Thermal wave assessment of quality of metal - ceramics bonding
Z. Suszynski and P. MajchrzakChair of Computer Engineering, Faculty of Electronics, Technical University of Koszalin, Sniadeckich Street, 75-453 Koszalin, Poland
Abstract
In this paper, the quality of bonding between Cu and
Al2O3 ceramics as well as Cu and AlN ceramics were measured and
compared. The method of adhesion quality assessment presented is based on
the analysis of amplitude and phase characteristics of the photoacoustic
signal.
© EDP Sciences 2005