Effect of solutes on the dynamic recrystallization microstructure of nickel

R. Le Gall; P. Bocher; B. Verlinden; J.J. Jonas

doi:doi:10.1051/jp4:2001410

Issue		J. Phys. IV France Volume 11, Number PR4, Septembre 2001 4^th European Mechanics of Materials Conference on Processes, Microstructures and Mechanical Properties


Page(s)		Pr4-77 - Pr4-82
DOI		https://doi.org/10.1051/jp4:2001410

4^th European Mechanics of Materials Conference on Processes, Microstructures and Mechanical Properties

J. Phys. IV France 11 (2001) Pr4-77-Pr4-82
DOI: 10.1051/jp4:2001410

Effect of solutes on the dynamic recrystallization microstructure of nickel

R. Le Gall¹, P. Bocher², B. Verlinden² and J.J. Jonas³

¹ Laboratoire Génie des Matériaux, ISITEM, BP. 90604, 44306 Nantes cedex 03, France
² Dept. MTM, K.U. Leuven, de Croylaan 2, 3001 Heverlee, Belgium
³ Department of Metallurgical Engineering, McGill University, Montreal, Quebec, H3A 2B2, Canada

Abstract
Solute drag effects during dynamic recrystallization were studied using four different nickel-sulphur alloys containing from 1 to 20 wt. ppm of sulphur. It was shown in an earlier paper that the steady state stress for dynamic recrystallization depends on the sulphur concentration. The aim of this paper is to discuss the effect of sulphur on the steady state grain size during dynamic recrystallization. The compression tests were carried out between 650°C and 1200°C at a constant strain rate of 10^-3 s^-1 until a shain of 1 was attained. The samples were then quenched in water within 1s. The grain sizes were measured after interrupted compression tests using both optical micrography and orientation imaging microscopy (OIM) measurements. As expected, the grain sizes decrease when the solute concentration is increased. A model taking into account the reduction of the mobility of random grain boundaries due to their interaction with sulphur and the occurrence of twinning is proposed to account for the steady state grain size during dynamic recrystallization.