Numéro |
J. Phys. IV France
Volume 06, Numéro C3, Avril 1996
WOLTE 2Proceedings of the Second European Workshop on Low Temperature Electronics |
|
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Page(s) | C3-231 - C3-236 | |
DOI | https://doi.org/10.1051/jp4:1996335 |
Proceedings of the Second European Workshop on Low Temperature Electronics
J. Phys. IV France 06 (1996) C3-231-C3-236
DOI: 10.1051/jp4:1996335
Improvements in GaAs JFETs for Deep Cryogenic Operation
T.J. CunninghamMail Stop 300-315, Jet Propulsion Laboratory, 4800 Oak Grove Drive, Pasadena, CA 91109, U.S.A.
Abstract
Gallium arsenide junction field-effect transistors (GaAs JFETs) can be made immune to carrier freeze-out, making such transistors useful for the readout of detector arrays that operate at 4 K. Typical applications require transistors with very low noise and extremely low leakage current. By using a recently developed etchant for GaAs that is highly isotropic, etched GaAs JFETs have fabricated that have a gently tapered edge. This reduces edge fields, which consequently reduces the edge tunneling current, the dominant source of leakage current at 4 K. JFETs with gate leakage currents below 10-15 amps have been fabricated. The fabrication technique, including the isotropic etchant is discussed. The leakage current and noise of these JFETs are presented and compared with previous devices using a conventional etch.
© EDP Sciences 1996