Numéro |
J. Phys. IV France
Volume 106, mars 2003
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Page(s) | 3 - 12 | |
DOI | https://doi.org/10.1051/jp4:20030210 |
J. Phys. IV France 106 (2003) 3
DOI: 10.1051/jp4:20030210
Elementary mechanisms of brittle and semi-brittle fracture
P. Gumbsch1, 21 Fraunhofer lnstitute for Mechanics of Materials (IWM), Wöhlerstrasse 11, 79108 Freiburg, Germany
2 University of Karlsruhe, Institute for Reliability of Componenfs and Systems (izbs), Kaiserstrasse 12, Geb. 10.91, 76131 Karlsruhe, Germany
Abstract
Advances in Our understanding of the mechanisms of brittle and semi-brittle fracture processes are often
made by direct comparison of microscopic modeling and carefully designed experiments. In this paper, examples are
taken from ab-initio simulations and empirical atomistic modeling of brittle fracture which show that the production
of metastable fracture surfaces or directional cleavage anisotropy are readily anticipated consequences of the discrete
nature of the bond breaking at the crack tip. Both phenomena have been reported from fracture experiments on Silicon
single crystals.
Dislocation simulations are helpful in analyzing the dependence of fracture toughness on predeformation, temperature or loading rate in semi-brittle materials below the brittle-to-ductile transition. By comparison of fracture experiments on tungsten single crystals with simulations it is shown that dislocation nucleation is the limiting factor at low tem- peratures, while the dependence on loading rate at intermediate temperatures requires that dislocation mobility takes control. Furthermore it is shown that the intermediate temperature regime up to the brittle-to-ductile transition temperature can be scaled onto a master curve with one unique activation energy.
© EDP Sciences 2003