Numéro
J. Phys. IV France
Volume 110, September 2003
Page(s) 27 - 32
DOI https://doi.org/10.1051/jp4:20020665


J. Phys. IV France
110 (2003) 27
DOI: 10.1051/jp4:20020665

Determining the constitutive response of polymeric materials as a function of temperature and strain rate

C.M. Cady, W.R. Blumenthal, G.T. Gray III and D.J. Idar

MST-8 MS G-755, Los Alamos National Laboratory, Los Alamos, NM 87545, U.S.A.


Abstract
Compression stress-strain measurements have been conducted on two commercial high temperature thermoplastic polymers (polyamideimide (PAI) and partially crystalline polyetheretherketone (PEEK)) as a function of temperature (-55 °C to 300 °C) and strain rate (0.001 s -1 to 2500 s -1). A split-Hopkinson pressure bar (SHPB) was used to achieve strain rates of about 2500 s -1 and conventional testing machines were used for strain rates from 0.001 s -1 to 1 s -1. A large variation in the mechanical response was observed over the range of temperatures tested for both polymers showing "yield" and "plastic" deformation below the glass transition temperature (T $_{\rm g}$). Above T $_{\rm g}$ both thermoplastic polymers exhibited increasing loading moduli with increasing strain rate or decreasing temperature. T $_{\rm g}$ appears to shift to higher temperatures as the strain rate increases. Below T $_{\rm g}$ both thermoplastic polymers exhibited a yield-type behavior followed by anelastic deformation. PEEK was seen to be more sensitive to strain rate and temperature than PAI. A range of different flow stress versus strain behaviors was observed at different temperatures and strain rates.



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