| Numéro |
J. Phys. IV France
Volume 07, Numéro C5, November 1997
IVth European Symposium on Martensitic Transformations
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|---|---|---|
| Page(s) | C5-275 - C5-280 | |
| DOI | https://doi.org/10.1051/jp4:1997543 | |
J. Phys. IV France 07 (1997) C5-275-C5-280
DOI: 10.1051/jp4:1997543
Recent Developments in Sputter-Deposited Ti-Ni-Base Shape Memory Alloy Thin Films
S. Miyazaki1, K. Nomura1, A. Ishida2 and S. Kajiwara21 Institute of Materials Science, University of Tsukuba, Tsukuba, Ibaraki 305, Japan
2 National Research Institute for Metals, 1-2-1 Sengen, Tsukuba, Ibaraki 305, Japan
Abstract
Since 1992 the present authors have been successful in making Ti-Ni shape memory alloy thin films, which
can show perfect shape memory effect and superelasticity equivalent to those of bulk materials, by utilizing a r.f.
sputtering method. In the present paper, some of their recent results were reviewed. The alloys investigated are Ti-Ni,
Ti-Ni-Cu and Ti-Ni-Pd, the alloy content ranging from 45.4 to 51.9 at%Ni for Ti-Ni, from 0 to 18.0 at%Cu for Ti-Ni-Cu and from 0 to 21.8 at%Pd for Ti-Ni-Pd. The Ti-Ni films were used for investigating the effects of Ni-content and
heat-treatment condition on the transformation and deformation behavior, the effect of cyclic deformation on the stability
of shape memory behavior, the effect of nonequilibrium state created during crystallization process on the transformation
behavior, etc. The Ti-Ni-Cu films were made in order to decrease the transformation hysteresis, while the
Ti-Ni-Pd films were made in order to increase the transformation temperatures : both are effective to increase the
response speed in actuation.
© EDP Sciences 1997