Numéro
J. Phys. IV France
Volume 05, Numéro C7, Novembre 1995
Second International Conference on Ultra High Purity Base Metals
UHPM - 95
Page(s) C7-389 - C7-396
DOI https://doi.org/10.1051/jp4:1995747
Second International Conference on Ultra High Purity Base Metals
UHPM - 95

J. Phys. IV France 05 (1995) C7-389-C7-396

DOI: 10.1051/jp4:1995747

Fatigue of High Purity Copper Wire

N. Tanabe1, A. Kurosaka2, K. Suzuki1 and O. Kohno1

1  Materials Research Laboratory, Fujikura Ltd. 1-5-1, Kiba, Koto-ku, Tokyo 135, Japan
2  Advanced Technology R&D Center, Fujikura Ltd. 1-5-1, Kiba, Koto-ku, Tokyo 135, Japan


Abstract
The fatigue properties of 7N, OFC and Tough-Pitch copper wires were evaluated by a rotational bending method. 7N copper wires, having RRR300K/4.2K of 7600, were produced by electro-refining, vacuum melting, zonerefining followed by suitable drawing processes, using 4N class commercial OFC plates as the starting material. The fatigue failure cycles of 7N copper increased with an increased pause period imposed during the fatigue test after 5x106 cycles. Remarkable recrystallizations initiated from the wire surface occurred in 7N copper after the pause period in the fatigue test. Strains accumulated during fatigue are considered to act as the driving force. It is expected that 7N copper can recover from fatigue by itself during practical service use and show excellent fatigue resistance.



© EDP Sciences 1995