J. Phys. IV France
Volume 05, Numéro C5, Juin 1995
Proceedings of the Tenth European Conference on Chemical Vapour Deposition
Page(s) C5-151 - C5-158
Proceedings of the Tenth European Conference on Chemical Vapour Deposition

J. Phys. IV France 05 (1995) C5-151-C5-158

DOI: 10.1051/jphyscol:1995516

Thermodynamic Simulation of YBa2Cu3O6+x Film Growth Using Aerosol MOCVD

F. Weiss1, A. Pisch1, 2, C. Bernard2 and U. Schmatz1

1  INPG-ENSPG-LMGP, B.P. 46, 38402 Saint-Martin d'Hères, France
2  INPG-ENSEEG-LTPCM, B.P. 75, 38402 Saint-Martin d'Hères, France

Future high power applications of high Tc superconducting materials (like YBa2CU3O6+x demand thick films with excellent electrical properties. The use of thin film deposition techniques is only possible when high deposition rates can be reached. A novel aerosol MOCVD technique using a liquid source has recently been developed and is very promising for this purpose. The precursor materials used are the [MATH]-diketonates of yttrium, barium and copper, dissolved in diethylene glycol dimethyl ether ("diglyme") in various concentrations. A preliminary thermodynamic simulation of the process is a useful tool for a deeper understanding of the stability limits of the superconducting phase and the on-going reactions during deposition. The results of these simulations have been used to optimise the process conditions for YBa2Cu3O6+x growth with good superconducting properties. A comparison between the simulation and the experimental results will be given and the influence of the main process parameters (deposition temperature, oxygen partial pressure, precursor concentration, ... ) will be shown.

© EDP Sciences 1995