| Numéro |
J. Phys. IV France
Volume 04, Numéro C7, Juillet 1994
8th International Topical Meeting on Photoacoustic and Photothermal Phenomena8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique |
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|---|---|---|
| Page(s) | C7-575 - C7-578 | |
| DOI | https://doi.org/10.1051/jp4:19947135 | |
8th International Topical Meeting on Photoacoustic and Photothermal Phenomena
8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique
J. Phys. IV France 04 (1994) C7-575-C7-578
DOI: 10.1051/jp4:19947135
1 Instituto de Física Gleb Wataghin, Universidade Estadual de Campinas, Unicamp, 13083-970 Campinas, São Paulo, Brazil
2 Institute of Isotopes, The Hungarian Academy of Sciences, P.O. Box 77, 1525 Budapest, Hungary
3 Department of Solid State Physics, Sofia University, 5 blvd James Boucher, 1126 Sofia, Bulgaria
4 Laboratoire d'Optique Physique, ESPCI, Laboratoire d'Instrumentation, UPMC, UPR A0005 du CNRS, 10 rue Vauquelin, 75005 Paris, France
© EDP Sciences 1994
8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique
J. Phys. IV France 04 (1994) C7-575-C7-578
DOI: 10.1051/jp4:19947135
Photothermal reflectance microscopy : signal contrast in the case of thick and thin grain interfaces in solids
A.M. Mansanares1, Z. Bozoki2, T. Velinov3, D. Fournier4 and A.C. Boccara41 Instituto de Física Gleb Wataghin, Universidade Estadual de Campinas, Unicamp, 13083-970 Campinas, São Paulo, Brazil
2 Institute of Isotopes, The Hungarian Academy of Sciences, P.O. Box 77, 1525 Budapest, Hungary
3 Department of Solid State Physics, Sofia University, 5 blvd James Boucher, 1126 Sofia, Bulgaria
4 Laboratoire d'Optique Physique, ESPCI, Laboratoire d'Instrumentation, UPMC, UPR A0005 du CNRS, 10 rue Vauquelin, 75005 Paris, France
Abstract
In this work a thick interface model is proposed in order to describe the photothermal signal perturbation introduced by grain interfaces. The validity of the model is discussed based upon photothermal reflectance microscopy results obtained on Fe sintered samples. A comparison with the thermal resistance model, which is valid only in the case of thin interfaces, is also presented.
© EDP Sciences 1994