| Issue |
J. Phys. IV France
Volume 110, September 2003
|
|
|---|---|---|
| Page(s) | 477 - 482 | |
| DOI | https://doi.org/10.1051/jp4:20020739 | |
J. Phys. IV France 110 (2003) 477
DOI: 10.1051/jp4:20020739
Dynamic properties of solders and solder joints
C.R. Siviour, D.M. Williamson, S.J.P. Palmer, S.M. Walley, W.G. Proud and J.E. FieldPCS Group, Cavendish Laboratory, Madingley Road, Cambridge CB3 OHE, U.K.
Abstract
The high strain rate mechanical properties have been measured for three types of solder: 63%Sn 37%Pb, 96.5Sn 3.5 Ag and 95.
5Sn 3. 8Ag 0. 7Cu. Bulk properties were measured using a split Hopkinson pressure bar (SHPB) at strain rates from 500 to 3000 s
-1. A novel method bas been designed and used to measure the shear strength of solder joints at low and high rates, using an
Instron and SHPB respectively.
© EDP Sciences 2003