Design of cryogenic electronics packaging for commercial production

Abstract
Laboratory cryogenic electronic systems typically contain many faults including vacuum leaks, cooling capacity inadequacies and high non-device heat loads. The inefficiencies in these systems are typically overcome by brute force, including active vacuum pumping, liquid cryogen cooling and so forth. Many otherwise viable electronic systems fail to gain market acceptance due to ancillary issues such as vacuum life and cryogenic packaging. An inefficient or unreliable design will not gain market acceptance in today's competitive commercial marketplace. This paper presents some of the real-world problems associated with commercial cryogenic packaging, and offers design strategies to overcome these problems