Numéro |
J. Phys. IV France
Volume 134, August 2006
EURODYMAT 2006 - 8th International Conference on Mechanical and Physical Behaviour of Materials under Dynamic Loading
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Page(s) | 1201 - 1206 | |
DOI | https://doi.org/10.1051/jp4:2006134183 | |
Publié en ligne | 26 juillet 2006 |
J. Cirne, R. Dormeval, et al.
J. Phys. IV France 134 (2006) 1201-1206
DOI: 10.1051/jp4:2006134183
Impact of a diamond coating on tool wear behaviour during dry machining of a multidirectional composite materials
D. Iliescu, D. Géhin, M. Nouari and F. GirotLaboratoire Matériaux Endommagement Fiabilité Ingénierie des Procédés (LAMEFIP), ENSAM CER Bordeaux, Esplanade des Arts et Métiers, 33405 Talence Cedex, France
Published online: 26 July 2006
Abstract
High mechanical performances and lightweight are the principal
characteristics of composite materials. However, the main problems
encountered when machining these materials are their poor
machinability and the short timelife of the tools. Hard diamond
coatings are attractive for cutting processes due to their high
hardness, low friction coefficient, excellent wear resistance and
chemical inertness. In the current study, damage mechanisms of the
uncoated tungsten carbide are compared to the coated one. Tool wear
behaviour was investigated at different cutting conditions when dry
machining the multidirectional carbon/epoxy composite T300/914. The
purpose is to determine the effect of the cutting parameters
(cutting conditions, forces, temperature, etc.) on the
tool-workpiece interface (surface integrity, roughness). The
experiments have been carried out under orthogonal cutting
configuration for both tools: uncoated and coated cemented carbide
WC-Co. Different coatings have been tested: diamond coating (thin
and thick diamond layer), and Diamond-Like Carbon (DLC coating).
Three rake angles of 0, 15
and 30
, two
cutting speeds of 6 and 60 m/min and three feeds rates of 0.05, 0.1,
0.2 mm were tested. The tool surface topography was analyzed using
complementary techniques such as white light interferometry,
scanning electron microscopy (SEM) and Auger electron spectroscopy
(AES).
© EDP Sciences 2006