Detection and analysis of subsurface cracks in ground ceramics using thermal wave method

Abstract
During a grinding of ceramics, its superficial layer undergoes structural changes. It results in significant decrease of thermal conductivity of surface. In this paper, a method of quality assessment of ceramics grinding based on analysis of depth profile of thermal properties using thermal wave methods is presented. The method proposed permits to determine a thickness as well as thermal conductivity of damaged layer. It enables indirect optimisation of machining of ceramics' surface.