| Numéro |
J. Phys. IV France
Volume 06, Numéro C8, Décembre 1996
ICIFUAS 11Eleventh International Conference on Internal Friction and Ultrasonic Attenuation in Solids |
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|---|---|---|
| Page(s) | C8-807 - C8-810 | |
| DOI | https://doi.org/10.1051/jp4:19968173 | |
Eleventh International Conference on Internal Friction and Ultrasonic Attenuation in Solids
J. Phys. IV France 06 (1996) C8-807-C8-810
DOI: 10.1051/jp4:19968173
Mechanical Spectroscopy and Structural Evolution of Thin CuMo Films
V. Branger1 and V. Pelosin21 Laboratoire de Métallurgie Physique, URA 131 du CNRS, Faculté des Sciences de Poitiers, BP. 179, 89960 Futuroscope cedex, France
2 Laboratoire de Mécanique et de Physique des Matériaux, URA 863 du CNRS, ENSMA, Site du Futuroscope, BP. 109, 89960 Futuroscope cedex, France
Abstract
It is well known that in thin metallic films, the anelastic and the elastic properties show some characteristic features linked to the specific microstructure. The studied films Cu30Mo70, with a typical thickness of 200nm are deposited by Ion Beam Sputtering (IBS) on oxidised silicon (100) substrates. The measurements are performed on a vibrating reed device adapted for thin adherent films over a temperature range between 20°C and 450°C. This paper reports the combined results of internal friction, elastic modulus and internal stresses measured during thermal cycling. "Direct" observations of the microstructure are performed by X-Ray diffraction. We have correlated the modifications of the mechanical properties with the structural evolution of these metastable systems.
© EDP Sciences 1996