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J. Phys. IV France
Volume 07, Numéro C5, November 1997
IVth European Symposium on Martensitic Transformations
Page(s) C5-269 - C5-274
IVth European Symposium on Martensitic Transformations

J. Phys. IV France 07 (1997) C5-269-C5-274

DOI: 10.1051/jp4:1997542

Electrodeposition of Thin Film Cu-Zn Shape Memory Alloys

D. Page and S. Roy

Department of Chemical and Process Engineering, University of Newcastle-upon-Tyne, Merz Court NEI 7RU, U.K.

Cu-Zn alloys have been electrodeposited from a pyrophosphate electrolyte containing Cu2P2O7, Zn2P2O7 salts and an excess of K4P2O7 and KNO3. Current-potential data for both copper and zinc, as well their plating current efficiencies were determined from electrochemical polarisation experiments. Copper deposition commenced at potentials below -0.208 V whereas zinc was deposited only below -1.157 V. The current efficiencies for both metals were found to be low ; typically 20-50% for copper and 5-10% for zinc. Although the potentials for electroreduction for the two components are disparate, alloys of brass containing 30-50%Cu were successfully produced with a current efficiency of 20%. Brass foils as thin as 10µm were produced by this method. The deposits were found to consist predominantly of [MATH] and [MATH] phases. It was found brass deposition on a copper substrate was preceded by a 1.5 µm thick CuZn5 layer.

© EDP Sciences 1997