J. Phys. IV France 05 (1995) C2-373-C2-378
Shape Memory Effect in Diffusion Bonded Cu Base Shape Memory Alloys/Steel InterfacesJ.M. Gómez de Salazar1, A. Ureña1, J.A. Serrano2, M. Aparicio1 and F.J. Méndez1
1 Departamento de Ciencias de los Materiales e Ingeniería Metalúrgica, Facultad de Ciencias Químicas, Universidad Complutense de Madrid, 28040 Madrid, Spain
2 Programa de Tecnología de Residuos, Centro de Investigaciones Energéticas, Medioambientales y Tecnológicas (CIEMAT), 28040 Madrid, Spain
In many applications, Cu base Shape Memory Alloys (SMA s) are a more economical alternative to other systems showing Shape Memory Effect (SME). However, bearing in mind the potential use of these SMA it is becoming increasingly important to develop suitable techniques to join them satisfactorily to themselves and to another material. In that sense, a liquid phase diffusion bonding process with silver/copper interlayers is proposed for bonding Cu base SMA s to the ASTM-1045 steel with semi-hard denomination. Specimens have been metallographically characterized by SEM. The bend strength of the bonded part is attained over 80% of that of the base materials. For checking the SME, the ratio of the total heat measured in forward to reverse thermoelastic martensitic transformation, measured by Differential Scanning Calorimetry (DSC), has been used.
© EDP Sciences 1995