| Numéro |
J. Phys. IV France
Volume 09, Numéro PR9, September 1999
3rd European Mechanics of Materials Conference on Mechanics and Multi-Physics Processes in Solids : Experiments, Modelling, Applications
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| Page(s) | Pr9-227 - Pr9-237 | |
| DOI | https://doi.org/10.1051/jp4:1999923 | |
3rd European Mechanics of Materials Conference on Mechanics and Multi-Physics Processes in Solids : Experiments, Modelling, Applications
J. Phys. IV France 09 (1999) Pr9-227-Pr9-237
DOI: 10.1051/jp4:1999923
Centre for Advanced Materials Technology, Department of Mechanical and Mechatronic Engineering, The University of Sydney, Sydney NSW 2006, Australia
© EDP Sciences 1999
J. Phys. IV France 09 (1999) Pr9-227-Pr9-237
DOI: 10.1051/jp4:1999923
Thermopiezoelectric interaction of crack-microcrack system in a piezoelectric plate
Q.-H. QinCentre for Advanced Materials Technology, Department of Mechanical and Mechatronic Engineering, The University of Sydney, Sydney NSW 2006, Australia
Abstract
This paper treats the crack-microcrack interactions in an anisotropic piezoelectric solid. Based on the Green's function approach and the principle of superposition, a system of singular integral equations for the unknown temperature discontinuity and elastic displacement-electric potential (EDEP) defined on each crack face is developed and solved numerically. In the analysis, the residual heat flux, stress and electric displacement (SED) on microcrack location to be released are evaluated directly from the near-tip fields of main crack. Numerical results for SED intensity factors in a three-crack system are presented to illustrate the application of the proposed formulation.
© EDP Sciences 1999