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Cited article:

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High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration

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Brittle Versus Ductile Failure of a Lead-Free Single Solder Joint Specimen Under Intermediate Strain Rate

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The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders

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High strain rate compression behavior for Sn–37Pb eutectic alloy, lead-free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys

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A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

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Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions

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Review of experimental techniques for high rate deformation and shock studies

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International Journal of Impact Engineering 30 (7) 725 (2004)
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