Ceramic/metal joining for structures and materials
J. Phys. IV France, 03 C7 (1993) C7-1317-C7-1326
Articles citing this article
The Citing articles tool gives a list of articles citing the current article.
The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).
Cited article:
This article has been cited by the following article(s):
Active Brazing of Alumina and Copper with Multicomponent Ag-Cu-Sn-Zr-Ti Filler
Sri Harini Rajendran, Seung Jun Hwang and Jae Pil JungMetals 11 (3) 509 (2021)
https://doi.org/10.3390/met11030509
Evaluation of Zirconia Nanofiller and Brass Alloy Assembly by X-Ray Radiography
A. KadhimJournal of Transition Metal Complexes 3 1 (2020)
https://doi.org/10.32371/jtmc/246103
Effect of Gold Nano Dots in Microwave Brazing: A Novel Approach to Join Ti6Al4V to MACOR®
Siddharth Tamang, Nitish Kumar and S. AravindanKey Engineering Materials 821 222 (2019)
https://doi.org/10.4028/www.scientific.net/KEM.821.222
Diffusion Bonding of Sialon to AISI 420 Martensitic Stainless Steel with Cut Off Heat upon Cooling
Nor Nurulhuda Md Ibrahim, Patthi Hussain and Mokhtar AwangAdvanced Materials Research 1133 249 (2016)
https://doi.org/10.4028/www.scientific.net/AMR.1133.249
Investigation of Ni-B Alloys for Joining of TiB2 Ultra-High-Temperature Ceramic
L. Xi, I. Kaban, R. Nowak, et al.Journal of Materials Engineering and Performance 25 (8) 3204 (2016)
https://doi.org/10.1007/s11665-016-1958-y
1669 020035 (2015)
https://doi.org/10.1063/1.4919173
Effect of Nitriding on Reaction Layer of Diffusion Bonded Sialon to AISI 420 Martensitic Stainless Steel
Nor Nurulhuda Md Ibrahim, Patthi Hussain and Mokhtar AwangApplied Mechanics and Materials 660 178 (2014)
https://doi.org/10.4028/www.scientific.net/AMM.660.178
Optimization of ceramics bonding in the area of pressure sensor manufacturing
Radovan Novotný, Radek Vlach, Jaroslav Kadlec and Radek KuchtaMicrosystem Technologies 20 (4-5) 719 (2014)
https://doi.org/10.1007/s00542-013-2013-7
Silicon Carbide Power Modules for High-Temperature Applications
Michael J. Palmer, R. Wayne Johnson, Tracy Autry, et al.IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2) 208 (2012)
https://doi.org/10.1109/TCPMT.2011.2171343
Interfacial behavior on Al2O3/HAYNES® 214™ joints fabricated by solid state bonding technique with Ni or Cu–Ni–Cu interlayers
M.L. Hattali, S. Valette, F. Ropital, N. Mesrati and D. TréheuxJournal of the European Ceramic Society 32 (10) 2253 (2012)
https://doi.org/10.1016/j.jeurceramsoc.2012.01.036
Joining of tungsten carbide to nickel by direct diffusion bonding and using a Cu–Zn alloy
José Lemus-Ruiz, Leonel Ceja-Cárdenas, J. A. Verduzco and Osvaldo FloresJournal of Materials Science 43 (18) 6296 (2008)
https://doi.org/10.1007/s10853-008-2894-5
Self-joining of Si3N4 using metal interlayers
José Lemus-Ruiz, Carlos A. León-Patiño and Robin A. L. DrewMetallurgical and Materials Transactions A 37 (1) 69 (2006)
https://doi.org/10.1007/s11661-006-0153-4
Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer
José G. Flores, José Cervantes and José Lemus-RuizMaterials Science Forum 509 99 (2006)
https://doi.org/10.4028/www.scientific.net/MSF.509.99
Joining of silicon nitride with a titanium foil interlayer
Jose Lemus and Robin A.L DrewMaterials Science and Engineering: A 352 (1-2) 169 (2003)
https://doi.org/10.1016/S0921-5093(02)00892-4