CVD Copper Deposition from CuI(HFAC)TMVS Studied Through a Modeling Experimental Design J.-L. Mermet, M.-J. Mouche, F. Pires, E. Richard, J. Torres, J. Palleau et F. BraudJ. Phys. IV France, 05 C5 (1995) C5-517-C5-523DOI: https://doi.org/10.1051/jphyscol:1995560
