Identification of efficient deposition conditions based on the determination of the effective thermal transport properties of Cu-C interface systems S. Chotikaprakhan, D. Dietzel, E. Neubauer, B.K. Bein et J. PelzlJ. Phys. IV France, 125 (2005) 395-398DOI: https://doi.org/10.1051/jp4:2005125092
