Evaluation of active semiconductor structures by combined scanning thermo-elastic microscopy and finite element simulations J.L. Nzodoum Fotsing, D. Dietzel, S. Chotikaprakhan, R. Meckenstock, J. Pelzl et S. CassetteJ. Phys. IV France, 125 (2005) 117-120DOI: https://doi.org/10.1051/jp4:2005125027
