CVD copper thin film deposition using (α-methylstyrene)Cu(I)(hfac) W. Zhuang, L. J. Charneski, D. R. Evans, S. T. Hsu, Z. Tang et A. M. GuloyJ. Phys. IV France, 11 PR3 (2001) Pr3-553-Pr3-560DOI: https://doi.org/10.1051/jp4:2001370
