Low pressure chemical vapor deposition of silicon oxynitride films using tetraethylorthosilicate, dichlorosilane and ammonia mixtures V. Em. Vamvakas, R. Berjoan, S. Schamm, D. Davazoglou et C. VahlasJ. Phys. IV France, 11 PR3 (2001) Pr3-231-Pr3-238DOI: https://doi.org/10.1051/jp4:2001329
