DOWNSTREAM MICROWAVE PLASMA ENHANCED CHEMICAL VAPOUR DEPOSITION OF SiO2 USING O2/SiH4 AND N2O/SiH4 MIXTURES H. DEL PUPPO, T. SINDZINGRE, L. PECCOUD et J. DESMAISONJ. Phys. IV France, 02 C2 (1991) C2-421-C2-428DOI: https://doi.org/10.1051/jp4:1991251
