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Cited article:

Structural properties of reactively sputtered W–Si–N thin films

A. Vomiero, E. Boscolo Marchi, A. Quaranta, et al.
Journal of Applied Physics 102 (3) 033505 (2007)
https://doi.org/10.1063/1.2761828

Composition and resistivity changes of reactively sputtered W–Si–N thin films under vacuum annealing

A. Vomiero, E. Boscolo Marchi, G. Mariotto, et al.
Applied Physics Letters 88 (3) 031917 (2006)
https://doi.org/10.1063/1.2166691

Structural and functional characterization of W-Si-N sputtered thin films for copper metallizations

Alberto Vomiero, Stefano Frabboni, Enrico Boscolo Marchi, et al.
MRS Proceedings 812 F3.10 (2004)
https://doi.org/10.1557/PROC-812-F3.10

The mechanical properties and microstructure of Ti–Si–N nanocomposite films by ion plating

Hisashi Watanabe, Yutaka Sato, Chaoyin Nie, et al.
Surface and Coatings Technology 169-170 452 (2003)
https://doi.org/10.1016/S0257-8972(03)00190-7

Evaluation of LPCVD MeSiN (MeTa, Ti, W, Re) diffusion barriers for Cu metallizations

E. Blanquet, A.M. Dutron, V. Ghetta, C. Bernard and R. Madar
Microelectronic Engineering 37-38 189 (1997)
https://doi.org/10.1016/S0167-9317(97)00111-1