Numéro
J. Phys. IV France
Volume 112, October 2003
Page(s) 507 - 510
DOI https://doi.org/10.1051/jp4:2003935


J. Phys. IV France
112 (2003) 507
DOI: 10.1051/jp4:2003935

Effect of microstructure on two-way shape memory effect in Cu-A1-Mn alloys

T. Omori, Y. Sutou, J.J. Wang, R. Kainuma and K. Ishida

Department of Materials Science, Graduate School of Engineering, Tohoku University, Aoba-yama 02, Sendai 980-8579, Japan


Abstract
The shape memory effect (SME) and the two-way shape memory effect (TWME) of Cu-A1-Mn alloys induced by single bending deformation at room temperature were investigated in relation to the microstructural features of grain size and texture. It was found that the control of the texture and/or grain size significantly improves not only the SME, but also the TWME. Especially, the specimen with near 112 <102 > texture obtained by cold-rolling and further recrystallization showed a high degree of TWME ( $\varepsilon_{TWME}= 3. 6$%) in the surface strain which is of the highest level of the TWME in the Cu-base shape memory alloys. It can be concluded that a high level of TWME in the bending deformation mode can be obtained from specimens with an excellent SME.



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