8 ITMP3 / 8éme conférence internationale de photoacoustique et photothermique
J. Phys. IV France 04 (1994) C7-199-C7-202
Photoacoustic laminated characterization of dynamic integrated circuitsJ.-W. Fang1, S.-Y . Zhang2 and J.-C. Cheng2
1 Department of Physics, Zhejiang Normal University, Jinhua 321004, China
2 Institute of Acoustics and Lab. of Modern Acoustics, Nanjing University, Nanjing 210093, China
The layered photoacoustic imaging of dynamic integrated circuits(IC) devices is studied experimentally and theoretically. The experimental method can be used not only to investigate the surface and subsurface structures, but also to analyze the operation modes of the electronic components and the operation principles of IC devices.
© EDP Sciences 1994