Numéro
J. Phys. IV France
Volume 03, Numéro C7, Novembre 1993
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés
Page(s) C7-1931 - C7-1936
DOI http://dx.doi.org/10.1051/jp4:19937309
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés

J. Phys. IV France 03 (1993) C7-1931-C7-1936

DOI: 10.1051/jp4:19937309

High temperature creep performance and microstructure of SiC-C-SiC composites

N. MOZDZIERZ and M. BACKHAUS-RICOULT

Laboratoire de Physique des Matériaux, CNRS, 92195 Meudon, France


Abstract
The high temperature creep behaviour of a 2D SiC/C/SiC composite is studied at temperatures ranging from 1200 to 1673K, under stresses from 50 to 500MPa. Due to the microstructural evolution of the material, steady state creep is never reached ; creep toughening is observed. Microcrack formation and propagation in the interface and in the matrix were identified as contributing to the deformation.



© EDP Sciences 1993