Numéro
J. Phys. IV France
Volume 03, Numéro C7, Novembre 1993
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés
Page(s) C7-1805 - C7-1810
DOI http://dx.doi.org/10.1051/jp4:19937286
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés

J. Phys. IV France 03 (1993) C7-1805-C7-1810

DOI: 10.1051/jp4:19937286

Structure et propriétés de la matrice des composites WC-W-Ni-Cu-Zn-Si renforcés avec des diamants synthétiques

H. COLAN, V. CONSTANTINESCU and R. ORBAN

Université Technique de Cluj-Napoca, Cluj-Napoca, Romania


Abstract
Although seems very attractive for economical reasons, the natural by synthectic diamonds replacement in the metal-diamond composites elaboration comes up against theirs less thermochemical stability. In order to avoid the possible reinforcement degradation and poor matrix-to-reinforcement bonding resulting from extensive interfacial reactions, processing temperatures below of about 1050 °C are required. On effect, the Cu-Sn-Ni binding alloys utilised in the metal-natural diamond composites elaboration by consecrated method - sintering by infiltration of loose mixture of powders, having processing temperatures of about 1150-1225°C, becomes unsuitable. The author's investigations have found as adequate for this purpose certain Cu-Zn-Si alloys (65. .70) - (25. .30) - (2.5..3.5) % having the liquidus temperatures 851..870°C, as well as a good wettability of solids. Also, certain WC-W-Ni (30. .90) - (0..40) - (3..16) % mixtures of powders ware found as appropriates. Solving Ni and, partial, both W and WC, the above mentioned infiltrating alloys act as a liquid phase and make possible the sintering process at temperatures of about 1025°C, leading to a good mechanical encapsulation of diamond grains, a fine structure of metal matrix and, consequently, to mechanical properties of the matrix comparable with those obtained with Cu-Sn-Ni binding alloys at the processing temperatures upper with about 200°C.



© EDP Sciences 1993