Numéro
J. Phys. IV France
Volume 03, Numéro C7, Novembre 1993
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés
Page(s) C7-1093 - C7-1098
DOI http://dx.doi.org/10.1051/jp4:19937171
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés

J. Phys. IV France 03 (1993) C7-1093-C7-1098

DOI: 10.1051/jp4:19937171

Diffusion bonding of hardmetals (WC-Co) with metallic interlayers

J.M. GÓMEZ DE SALAZAR and A. UREÑA

Dpto. Ciencia de los Materiales e Ingeniería Metalúrgica, Facultad de Ciencias Químicas, Universidad Complutense de Madrid, 28040 Madrid, Spain


Abstract
Diffusion bonding of hardmetals (WC-Co) to themselves or with other metallic material (mild-steel) has been evaluated in the present paper. Metallographic studies and mechanical tests have been used to determinate the influence of the bonding parameters (temperature, pressure and time) on the bond microstructure and strength. Different metallic interlayers applied in form of thick foils were used (nickel, nickel-copper and stainless steel). Special interest was dedicated to the solid state reactions occurred in the bond interfaces.



© EDP Sciences 1993