Numéro
J. Phys. IV France
Volume 03, Numéro C7, Novembre 1993
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés
Page(s) C7-1037 - C7-1042
DOI http://dx.doi.org/10.1051/jp4:19937161
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés

J. Phys. IV France 03 (1993) C7-1037-C7-1042

DOI: 10.1051/jp4:19937161

Bonding of aluminium matrix composites for application in the transport industry

A. UREÑA and J.M. GÓMEZ DE SALAZAR

Dpto. Ciencia de los Materiales e Ingeniería Metalúrgica, Facultad de Ciencias Químicas, Universidad Complutense de Madrid, 28040 Madrid, Spain


Abstract
A discontinuously reinforced MMC containing 12 vol % SiC particles in an Al-Cu-Mg alloy (AA 2124) matrix has been diffusion bonded. Thick interlayers of different superplastic aluminium alloys (Al-Li 8090 and Al-Cu SUPRAL) were used to reduce the bonding pressure and ensure complete surface contact. Microstructural studies shown higher continuity in joints bonded with 8090 interlayer than with other alloys. Precipitation of rich-copper intermetallic was detected, after bonding, in the interlayer because diffusion of Cu from 2124 matrix. Results suggest that Li contained in the interlayer favours the partial disruption of the aluminium oxide film, making easier the solid state bonding.



© EDP Sciences 1993