Numéro
J. Phys. IV France
Volume 03, Numéro C7, Novembre 1993
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés
Page(s) C7-995 - C7-998
DOI http://dx.doi.org/10.1051/jp4:19937154
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés

J. Phys. IV France 03 (1993) C7-995-C7-998

DOI: 10.1051/jp4:19937154

Microstructure characterization in electrodeposited Cu-coatings obtained at different bath temperatures

I. HANDREG, P. KLIMANEK and H. WEIDNER

TU Mining Academy Freiberg, Department of Material Science, P.O. Box 49, 09599 Freiberg/Sa., Germany


Abstract
X-ray profile and texture analysis, optical microscopy and microhardness measurement were used in order to study the dependence of the microstructure formation of electrodeposited copper coatings on the bath temperature. The coatings were obtained from an acid electrolyte without any additions within a temperature range from -10 °C up to 110 °C on polycrystalline copper and amorphous carbon substrates. The obtained temperature dependence of dislocation density is similar to that of the microhardness. Above room temperature the lattice perfection and the main grain size rapidly increase. At all temperatures deposition on carbon leads to a <110>-fibre texture, but on copper substrates a texture change of the coatings from a <110>-fibre to a more complicated, substrate-related epitaxial texture was observed.



© EDP Sciences 1993