Numéro
J. Phys. IV France
Volume 03, Numéro C7, Novembre 1993
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés
Page(s) C7-635 - C7-641
DOI http://dx.doi.org/10.1051/jp4:19937102
The 3rd European Conference on Advanced Materials and Processes
Troisiéme Conférence Européenne sur les Matériaux et les Procédés Avancés

J. Phys. IV France 03 (1993) C7-635-C7-641

DOI: 10.1051/jp4:19937102

Some aspects of anelastic and microplastic creep of pure Al and two Al-alloys

S. SGOBBA, H.-U. KÜNZI and B. ILSCHNER

Laboratoire de Métallurgie Mécanique, Département des Matériaux, Ecole Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland


Abstract
Anelastic creep of pure Al, commercial Al-Cu and a binary Al-Cu alloy has been measured at room temperature by means of a high resolution laser interferometer. The irreversible component of the deformation was also quantified from measurements of the anelastic creep recovery. The dependence of the deformation-time curves on thermal treatment and cold work is analyzed. The mechanisms responsible for the room temperature anelastic creep are discussed. Materials loaded below their elastic limit can present either a pure anelastic behavior (commercial Al-Cu) or additional viscoelastic creep (pure Al, high purity Al-Cu). For commercial Al-Cu, the presence of an irreversible deformation appears to be mainly related to the state of the surface. A viscoelastic after effect has been measured for this alloy after a Cu-electroplating treatment. As a typical result for room temperature creep, the irreversible deformation depends logarithmically on load time.



© EDP Sciences 1993