Numéro
J. Phys. IV France
Volume 02, Numéro C2, Septembre 1991
Proceedings of the Eighth European Conference on Chemical Vapour Deposition / Actes de la 8ème Confèrence Européenne sur les Dépôts Chimiques en Phase Gazeuse
Page(s) C2-271 - C2-278
DOI http://dx.doi.org/10.1051/jp4:1991233
Proceedings of the Eighth European Conference on Chemical Vapour Deposition / Actes de la 8ème Confèrence Européenne sur les Dépôts Chimiques en Phase Gazeuse

J. Phys. IV France 02 (1991) C2-271-C2-278

DOI: 10.1051/jp4:1991233

NEW OMCVD PRECURSORS FOR SELECTIVE COPPER METALLIZATION

J.A.T. NORMAN, B.A. MURATORE, P.N. DYER, D.A. ROBERTS and A.K. HOCHBERG

SCHUMACHER, 1969 Palomar Oaks Way, Carlsbad, California , U.S.A


Abstract
Due to its excellent electrical conductivity and high electromigration resistance, copper is widely predicted to be the interconnect metal of the future for electronic microdevices. This presentation focusses upon the synthesis of a new series of volatile liquid Cu+l complexes which are shown to be suitable for the deposition of pure, adherent and highly conducting copper films by CVD. Selective depositions onto metallic versus insulating dielectric substrates are achieved between 120 to 420°C with growth rates in excess of 100 nm/min and grain sizes as low as 0.1 microns. In addition, a novel complementary copper etching process is discussed that is chemically compatible with the copper CVD chemistry.



© EDP Sciences 1991