Issue
J. Phys. IV France
Volume 129, October 2005
Page(s) 275 - 279
DOI https://doi.org/10.1051/jp4:2005129056


J. Phys. IV France 129 (2005) 275-279

DOI: 10.1051/jp4:2005129056

Detection and analysis of subsurface cracks in ground ceramics using thermal wave method

Z. Suszynski, P. Majchrzak and W. Musial

Chair of Computer Engineering, Faculty of Electronics, Technical University of Koszalin, Sniadeckich Street, 75-453 Koszalin, Poland


Abstract
During a grinding of ceramics, its superficial layer undergoes structural changes. It results in significant decrease of thermal conductivity of surface. In this paper, a method of quality assessment of ceramics grinding based on analysis of depth profile of thermal properties using thermal wave methods is presented. The method proposed permits to determine a thickness as well as thermal conductivity of damaged layer. It enables indirect optimisation of machining of ceramics' surface.



© EDP Sciences 2005

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