Issue
J. Phys. IV France
Volume 129, October 2005
Page(s) 265 - 269
DOI https://doi.org/10.1051/jp4:2005129054


J. Phys. IV France 129 (2005) 265-269

DOI: 10.1051/jp4:2005129054

Thermal wave assessment of quality of metal - ceramics bonding

Z. Suszynski and P. Majchrzak

Chair of Computer Engineering, Faculty of Electronics, Technical University of Koszalin, Sniadeckich Street, 75-453 Koszalin, Poland


Abstract
In this paper, the quality of bonding between Cu and Al2O3 ceramics as well as Cu and AlN ceramics were measured and compared. The method of adhesion quality assessment presented is based on the analysis of amplitude and phase characteristics of the photoacoustic signal.



© EDP Sciences 2005

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